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Vincent P. Manno received the B.S. degree from Columbia University, New York ... M.S. and Ph.D. degrees from the Massachusetts Institute of Technology (MIT), ...

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 25, NO. 3, SEPTEMBER 2002

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Foreword Introduction to SEMI-THERM XVII Special Section

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HE 17th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XVII) was held in San Jose, CA, March 20–22, 2001. Over 30 full-length papers were included in the proceedings and presented to one of the largest audiences in SEMI-THERM history. A number of outstanding papers from the symposium were selected for further peer review and possible publication in these CPMT TRANSACTIONS. The four papers included in this special section represent the best of this select group. They span the gamut of electronic thermal management applications and challenges. Guarino and Manno analyze and test the potential of cooling portable computers using laminar jet impingement in standalone and heat pipe hybrid arrangements. The authors of this paper were recognized with the 2001 Harvey Rosten Award for Excellence. Jiang et al. describe the development and experimental characterization of an innovative micro-channel cooling system, which uses an electrokinetic pump. Phelan et al. explore the current performance and future potential of miniature refrigeration systems as an alternative in high power electronic thermal management.

Finally, Lasance presents a provocative consideration of the promise and realities of both experimental and analytical thermal characterization. As coeditors, we thank the authors of all the papers that were considered for this special section and express our special appreciation to the following reviewers: Cathy Biber, Michael Ellsworth, Suresh Garimella, Tortsten Hauck, Clemens Lasance, Tom Lee, Marta Rencz, Roger Schmidt, Elliott Short, Viktor Szekely, and Bahman Tavassoli. VINCENT P. MANNO, Guest Editor Tufts University Medford, MA 02155 USA ROBERT E. SIMONS, Guest Editor IBM (retired) Poughkeepsie, NY USA JAMES WILSON, Guest Editor Raytheon Electronic System Dallas, TX 75080 USA

Digital Object Identifier 10.1109/TCAPT.2002.800597

Vincent P. Manno received the B.S. degree from Columbia University, New York, NY, and the M.S. and Ph.D. degrees from the Massachusetts Institute of Technology (MIT), Cambridge. He is Associate Dean of Engineering and Professor of Mechanical Engineering at Tufts University, Medford, MA. Prior to joining the Tufts faculty in 1984, he held positions at MIT and in the power industry. He has also served as a Senior Summer Faculty Fellow at the Naval Undersea Warfare Center. His fields of expertise are computational modeling of thermal-fluid applications and power plant engineering. His research has been sponsored by both government and industry. He serves on the Review Committee for the Reactor Engineering Division, Argonne National Lab. He has authored or coauthored approximately 100 journal articles and technical reports. Dr. Manno received the SAE Ralph R. Teetor Outstanding Engineering Educator Award and the Harvey Rosten Award for Excellence in the Physical Design of Electronics. He was General Chair of the 1996 IEEE SEMI-THERM Symposium and serves as a Guest Editor of the IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGY. 1521-3331/02$17.00 © 2002 IEEE

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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 25, NO. 3, SEPTEMBER 2002

Robert E. Simons received the B.S. degree in mechanical engineering from Widener University, Chester, PA, and the M.S. degree in operations research and applied science from Union College, Schenectady, NY. He has been engaged in the development of cooling technologies for electronic equipment for more than 30 years. Prior to retiring from IBM in 1993, he was a key participant in the thermal design and development of cooling technologies for the IBM 3033, 3081, and 3090 processors, as well as the development of direct liquid immersion cooling techniques. He now has 42 issued patents and has published over 50 papers, book chapters, and articles related to cooling electronic packages and systems. He is currently an Associate Editor for Electronics Cooling Magazine. In the past several years he has conducted many lectures and seminars around the world on cooling electronic equipment. Mr. Simons recieved the IBM Outstanding Innovation Award and the Corporate Award [for inventing the cooling scheme for the IBM thermal conduction module (TCM)], ten IBM Invention Achievement Awards for his patents and invention publications, and the Semi-Therm Outstanding Contributor Award in 1995. While at IBM, he was elected a Member of the IBM Academy of Technology. He has been an active participant and organizer of SEMI-THERM Symposia for 18 years serving in the capacities of Session, Program, and General Chairman. He has served a number of times as a Guest Editor of the IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. He is also a Past Chairman of the ASME Heat Transfer Division K-16 Committee on Heat Transfer in Electronic Equipment.

James Wilson received the B.S.M.E. degree from Texas Tech University, Lubbock, in 1984, the M.S.M.E. degree from Stanford University, Stanford, CA, in 1985, and the Ph.D. degree from Southern Methodist University, Dallas, TX, in 1997. He is Principal Mechanical Engineer with Raytheon Electronic Systems and has 17 years experience in electronics cooling. He has spent the last 12 years emphasizing thermal design and analysis of microwave systems ranging from individual microwave components to airborne radars to large space based radar antennas. He has authored and presented over 15 papers related to electronics cooling. Dr. Wilson was the Program Chair for the Semi-Therm XVII Conference.

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