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1. AGENCY USE ONLY ( Leave Blank)
11MAR03
2. REPORT DATE
3. REPORT TYPE AND DATES COVERED
FINAL,01«ft9«99-31MAY02 4. TITLE AND SUBTITLE
Integrated Microelectronics and Photonics Active Cooling Technology (IMPACT)
5. FUNDING NUMBERS DAAD19-99-1-0158
6. AUTHOR(S)
J. Bowers, A. Shakourl, A. Majumdar, V. Narayanamurti, E. Croke 7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) John Bovvers, Univci^lly of California al Sitnia Batbiira, ECE Dcpailmcnl Satita Barbara, CA 93106
8. PERFORMING ORGANIZATION REPORT NUMBER
9. SPONSORING / MONITORING AGENCY NAME(S) AND ADDRESS(ES)
10. SPONSORING/MONITORING AGENCY REPORT NUMBER
U. S. Army Research Office P.O. Box 12211 Research Triangle Park, NC 27709-2211
P-40068-EL
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12 b. DISTRIBUTION CODE
Approved for public release; distribution unlimited. 13. ABSTRACT (Maximum 200 words)
The primary goal of the IMPACT effort is to demonstrate the advantages of helerostructure integrated thermionic (HIT) coolers and their integration with microelectronics and photonics. The majority of our research involves the development of this new technology through nanostructured materials design and growth; device design and fabrication; simulation and modeling; novel measurements of thermoelectric and thermionic behavior; and systems integration and packaging.
14. SUBJECT TERMS
15. NUMBER OF PAGES
cooling technology, thermionic coolers, thermoelectric coolers, semiconductor heterostructures, integrated microelectronics and photonics, nanostructures, packaging
135 16. PRICE CODE
17. SECURITY CLASSIFICATION OR REPORT UNCLASSIFIED NSN 7540-01-280-5500
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20030326 082
Integrated Microelectronics and Photonics Active Cooling Technology (IMPACT) Final Report
Performers:
University of California Santa Barbara University of California Santa Cruz University of California Berkeley Harvard University HRL Laboratories
Professor John Bowers, UCSB (Director)
(805) 893-8447
Professor Mi Shakouri. UCSC (Technical Director) (831)459-3821
DISTRIBUTION STATEMENT A Approved for Public Release Distribution Unlimited Agent: Army Research Office Dwiqht Woolard (919) 549-4297
Table of Contents 1. Abstract
3
2. Scientific Personnel
4
3. Scientific Progress and Accomplishments
5
4. Awards
7
5. Inventions
7
6. Publication List
8
7. Reprints (peer-reviewed)
12
Abstract The primary goal of the IMPACT effort is to demonstrate the advantages of heterostructure integrated thermionic (HIT) coolers and their integration with microelectronics and photonics. The majority of our research involves the development of this new technology through nanostructured materials design and growth; device design and fabrication; simulation and modeling; novel measurements of thermoelectric and thermionic behavior; and systems integration and packaging. During our effort, SiGe/Si superlattice microcoolers have been integrated with thin film heaters. Use of a heat load on top of device allowed direct measurement of cooling power density. It was observed that smaller size cooler devices (40-50 micron in diameter) have cooling power density much larger than larger devices (100 micron in diameter). A detailed theory has been developed which predict accurately the maximum cooling temperature and cooling power density for various device sizes. We improved the characterization of cross sectional temperature profile in thin film thermionic coolers with 40-50kHz) is limited by the thermal mass of the metalization on top of the device and it is independent of the superlattice thickness or the device diameter. We continued S-co measurements of thermal conductivity (77-400K) of various superlattice structures in order to minimize the thermal conductivity. Electron transmission in various superlattices has also been experimentally studied using ballistic electron emission microscopy.
Scientific Personnel John E. Bowers
(UCSB)
PI
Chris Labounty
(UCSB)
PhD (earned under Heretic)
Xiaofeng Fan
(UCSB)
PhD (earned under Heretic)
Gehong Zeng
(UCSB)
Visiting Researcher
All Shakourl
(UCSC)
Co-PI
Daryoosh Vashaee
(UCSC)
PhD Student
Yan Zhang
(UCSC)
PhD Student
James Christofferson
(UCSC)
IVIS Student
Arun Majumdar
(UCB)
Co-PI
Andrew Miner
(UCB)
PhD Student
Scott Huxtable
(UCB)
PhD Student
Venky Narayanamurti
(Harvard)
Co-PI
R.G. Mani
(Harvard)
Research Associates
1. Aitfeder
(Harvard)
Research Associates
J. Yoon
(Harvard)
PhD Student
Ed Croke
(HRL)
Co-PI
Howard Dunlap
(HRL)
Researcher
Kevin Hoiabird
(HRL)
Researcher
Scientific Progress and Accomplishments Project Goals The primary goal of the IMPACT effort is to demonstrate the advantages of heterostructure integrated thermionic (HIT) coolers and their integration with microelectronics and photonics. The majority of our research involves the development of this new technology through nanostructured materials design and growth; device design and fabrication; simulation and modeling; novel measurements of thermoelectric and thermionic behavior; and systems integration and packaging.
Approach Materials design is focused on increasing the cooling power and efficiency with thermionics and phonon bandgap engineering in superlattices. Electrical and thermal transport measurements are used to verify model predictions and aid in further improvements in device and materials design. Simulations are used to determine device limitations and non-ideal effects. Ultimately, thermionic devices are to be integrated and packaged for systems demonstration.
Accomplished Milestones Design and fabrication of both n- and p-SiGe/Si superlattice coolers on a SOI (silicon on insulator) substrate. Detailed 2D and 3D electro thermal modeling of superlattice coolers. Accurate prediction of maximum cooling (4.5K at room temperature) and cooling power density (680W/cm2) for various device sizes and superlattice material. Integration of micro thin film heaters with cooler devices to characterize the cooling temperature and cooling power density of different superlattices thicknesses. Measured frequency response of SiGe superlattice micro coolers using thermoreflectance imaging technique (>40-50kHz for superlattice thickness 1-6um, device size 40-1 OOum in diameter). 3-co measurements of thermal conductivity (77-400K) of various superlattice structures. Cross sectional thermal microscopy of thin film thermionic coolers with
