Mechanical Properties of Copper Thin Films Used in Electronic ... - Core

Available online at www.sciencedirect.com

Procedia Engineering 10 (2011) 1497–1502

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1877-7058 © 2011 Published by Elsevier Ltd. Open access under CC BY-NC-ND license. Selection and peer-review under responsibility of ICM11 doi:10.1016/j.proeng.2011.04.250

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Shengde Zhang et al. / Procedia Engineering 10 (2011) 1497–1502

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